TSM-113-01-L-DV-TR - CONN HEADER SMD 26POS 2.54MM
Monaróir Cuid Uimhir
Inmheánach Cuid Uimhir
Monaróir
Cur Síos Achomair
CONN HEADER SMD 26POS 2.54MM
Stádas RoHS
Luaidhe saor in aisce / RoHS comhlíontach
Am seachadta
1-2 lá
Ar fáil Cainníocht
208745 Pieces
Tagairt Praghas
ár Praghas
- (Téigh i dteagmháil linn le haghaidh ar phraghas níos fearr: [email protected])
- AX leathsheoltóra ní mór TSM-113-01-L-DV-TR i stoc dhíol.
- Roghanna Loingseoireacht agus loingseoireachta am:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Roghanna Íocaíochta:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Sonraíochtaí le haghaidh TSM-113-01-L-DV-TR
Ráthaíocht :
365 lá bharántas
stoc Acmhainní :
Franchised Dáileoir / Manufacturer Direct
Tír thionscnaimh :
USA / TAIWAN / MEXICO / MALAYSIA / PHI
Cuid Uimhir :
TSM-113-01-L-DV-TR
Monaróir :
Samtec Inc.
Tuairisc :
CONN HEADER SMD 26POS 2.54MM
Sraith :
TSM
Stádas Cuid :
Active
Cineál Ceanglóra :
Header
Cineál Teagmhála :
Male Pin
Tuinairde :
0.100" (2.54mm)
Líon Post :
26
Líon na Sraitheanna :
2
Spásáil Rae - Mating :
0.100" (2.54mm)
Líon na bpost a luchtaíodh :
All
Stíl :
Board to Board or Cable
Ardaithe :
Unshrouded
Cineál Gléasta :
Surface Mount
Foirceannadh :
Solder
Cineál Ceangail :
Push-Pull
Teagmháil Fad - Mating :
0.230" (5.84mm)
Teagmháil Fad - Post :
-
Fad Teagmhála Tríd is tríd :
-
Airde Inslithe :
0.100" (2.54mm)
Déan teagmháil le Cruth :
Square
Teagmháil Críochnaigh - Mating :
Gold
Teagmháil Críochnaigh Tiús - Mating :
10.0µin (0.25µm)
Déan teagmháil le Finish - Post :
Tin
Teagmháil Ábhar :
Phosphor Bronze
Ábhar Inslithe :
Liquid Crystal Polymer (LCP)
Gnéithe :
-
Teocht Oibriúcháin :
-55°C ~ 125°C
Cosaint Ionsaithe :
-
Rátáil Inadhainteachta Ábhar :
UL94 V-0
Dath Inslithe :
Black
Rátáil Reatha :
-
Rátáil Voltais :
-
meáchan :
-
coinníoll :
Nua agus bunaidh
Doiciméid do TSM-113-01-L-DV-TR
datasheets :
TSM-113-01-L-DV-TR.pdf
Gaolmhar le haghaidh TSM-113-01-L-DV-TR Samtec Inc.
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